MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088721 A) filed by Qualcomm Incorporated on July 21, 2026, for Extrapolation And Interactions Of Digital... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088725 A) filed by Windmller & Hlscher Se & Co. Kg on July 21, 2026, for Winder, System, And Method. In... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088730 A) filed by Ge Vernova Infrastructure Technology LLC on July 21, 2026, for A Method For Repairing... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088731 A) filed by Mitsui Kinzoku Company, Limited on July 21, 2026, for Exhaust Gas Purification Cataly... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088738 A) filed by Tangram Therapeutics Plc on July 21, 2026, for Inhibitors Of Expression And/Or Functi... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088743 A) filed by Pharma Foods International Co. , Ltd. on July 21, 2026, for Method For Producing ?-Am... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088748 A) filed by Spore Biotechnologies on July 21, 2026, for Device For Detecting Bacteria In A Sample... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088759 A) filed by Qualcomm Incorporated on July 21, 2026, for Resolving Ambiguity Of User Equipment Ser... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088760 A) filed by Pepsico, Inc. on July 21, 2026, for Resealable Beverage Can. Inventors include Grego... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088780 A) filed by Qualcomm Incorporated on July 21, 2026, for Package Comprising Substrates, Integrated... Read More